Select_MICRO_Sequence

Autocatalytic Coatings & Technology

Stapleton Technologies Inc.

Home

Technologies

Product List

ISO 9001:2000

Projects

History

MICRO Sequences

Hydrogen

These process sequences have been provided to give semiconductor engineers a means of efficiently metalizing wafers with Nickel and Gold or other metals. This is only a brief list of the processes sequences that are available for metalization offered by Stapleton.

MICRO Sequences

This process is used widely for the processing of MOSFET and other CMOS devices that are either clip bonded or soldered to a carrier. The process is also used in CSP applications where the device is solder directly to the board.

For more information about this service:

E-mail phil@stapletontech.com

Sequence 1010, Acid Zincate Process on Aluminum

This process sequence is more conventional and uses the double zincate cycle with an alkaline zincate. This process uses more steps than the 1010 and will have superior adhesion on pure aluminum substrates.

For more information about this service:

Sequence 1020, Alkaline Zincate Process on Aluminum

This process sequence provides a means of activating copper substrates by depositing a nm thick layer of palladium that acts as a catalytic initiation layer for subsequent nickel and gold deposition.

For more information about this service:

Sequence 1033, Palladium Activation on Copper

This process sequence provides a means of activating silicon by depositing a nm thick layer of palladium onto the silicon and then depositing a 200nm layer of Cobalt Nickel that is subsequently rapid thermal annealed to form a Cobalt Nickel silicide Ohmic contact.

For more information about this service:

Sequence 1042-1043, Palladium Activation on Silicon

E-mail phil@stapletontech.com