Autocatalytic Coatings & Technology

Stapleton Technologies Inc.

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Hydrogen

Acid Zincate pretreatment process for Aluminum substrates

This process uses chemistry that remains acidic for most of the process producing a uniform zincate film on alloy aluminum with minimal etching of the substrate. The typical amount etched from the wafer is 30nm. Because the process can be applied without double zincate steps, like conventional processing, the amount of material removed and the number of rinse and process steps are significantly reduced. This represents a large reduction on the overall cost.

The process is also formulated to be very clean with most processes having less that 1 ppm Na or K in the working solution. These materials are manufactured with UHP chemicals and the compounding process is controlled to ppb ranges in controlled spaces.

Benefits

 Reduced etch of Aluminum substrate

 Reduced number of steps including rinse

 Improved rinsing with acid chemistry

 Compatible with polyamide and resists

 CMOS grade materials @ <1 ppm Na & K

 Lower cost with less steps and stations

 Over 10 years of production history

Phone: 562-437-0541

Fax: 562-437-8632

E-mail: info@stapletontech.com

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Sequence 1010

Process Materials

Process

Description

Technical Data Sheet

Material Safety Data Sheet

MICRO 209

Cleaner, TMAH

MICRO 209 DS

MICRO 209 MSDS

MICRO 210

Cleaner, Organic Acid

MICRO 210 DS

MICRO 210 MSDS

MICRO 212

Cleaner, Organic Acid + HF

MICRO 212 DS

MICRO 212 MSDS

MICRO 242

Deox, Nitric Acid

MICRO 242 DS

MICRO 242 MSDS

MICRO 262

Acid Zincate

MICRO 262 DS

MICRO 262 MSDS

MICRO 282

Autocatalytic Nickel

MICRO 282 DS

MICRO 282 MSDS

MICRO 290

Immersion Gold

MICRO 290 DS

MICRO 290 MSDS

MICRO 291

Hybrid Autocatalytic Gold

MICRO 291 DS

MICRO 291 MSDS