Autocatalytic Coatings & Technology

Stapleton Technologies Inc.

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Acid Zincate pretreatment process for Aluminum substrates

This process uses chemistry that remains acidic for most of the process producing a uniform zincate film on alloy aluminum with minimal etching of the substrate.  The typical amount etched from the wafer is 30nm.  Because the process can be applied without double zincate steps, like conventional processing, the amount of material removed and the number of rinse and process steps are significantly reduced.  This represents a large reduction on the overall cost.

The process is also formulated to be very clean with most processes having less that 1 ppm Na or K in the working solution.  These materials are manufactured with UHP chemicals and the compounding process is controlled to ppb ranges in controlled spaces.

Benefits

· Reduced etch of Aluminum substrate

· Reduced number of steps including rinse

· Improved rinsing with acid chemistry

· Compatible with polyamide and resists

· CMOS grade materials @ <1 ppm Na & K

· Lower cost with less steps and stations

· Over 10 years of production history

 

Phone: 562-437-0541

Fax: 562-437-8632

E-mail: info@stapletontech.com

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Sequence 1010

Process Materials